Sponsoring Package – Embedded Platforms Conference (eEPC)

Diamond Package (for 1 sponsor)

• 1 Information screen in ICM (exclusive)
• Presentation surface below the ICM information screen, e.g. for demonstrator (low-noise)
• Company logo appears on program booklet
• 1 PDF (max. 15 MB) with company profile on conference media that all participants receive after the conference
• 1/4 Ad in the Visitor Guide
• 1 Insert/company brochure in conference tote bag (circulation 300 copies)
• Company brochure on display in the ICM and at the electronica Embedded Forum
• Logo on information boards for the respective conference at the trade fair center
• 1 Half-size banner in an issue of the electronica newsletter and 1 medium rectangle in the online catalog (300 x 250 px)
• Logo presence in the respective conference section at electronica.de
• 1 Online press compartment at electronica.de
• 4 Conference tickets to the respective conference